Concurrent inspection of both sides of the coin enables top and bottom mint alignment verification, in addition to the standard quality checks. The compact design not only saves space on the production floor, but also significantly reduces overal system system complexity.
Whilst employing precision technology and highly autonomous operation, Microps X remains both minimalistic and cost-effective.
Microps, next generation coin inspection.
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Mint alignment verification (top and bottom side)
Compact and accessible design
High speed and precision
Automated system calibration
Pneumatic rejection system
Self cleaning cameras
Remote operation
Real-time/Archived statistics and analysis
100% accuracy up to 30 microns
Up to 3,000 coins per minute
Diameter (outer): 12mm - 35mm
Diameter (inner): 8mm - 30mm
Thickness: 1mm - 5mm
Compatible with all metals (steel, nickel, copper, bimetalic, silver, aluminium, etc.)
Compatible with all types (circular, ring, bimetallic, scalloped, etc.)
60 second calibration
Intuitive touchscreen HMI display
We are a group of research scientists and developers with a passion for cutting edge technology.
We believe that we can change the face of industrial automation through a fresh approach towards solving problems, keeping our clients a step ahead of the competition.
